1. Top layer:

Designed for top copper foil routing. If it is a single panel, there is no such layer.

2. Bomtom layer:

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It is designed as the bottom copper foil wiring.

3. Top / bottom layer:

The top / bottom layer shall be covered with solder green oil to prevent tin on copper foil and maintain insulation. The green oil window shall be opened at the solder pad, via hole and non electrical wiring of this layer.

By default, the pad will be windowed (override: 0.1016 mm), that is, the pad will expose copper foil, expand by 0.1016 mm, and tin will be added during wave soldering. It is suggested that no design changes should be made to ensure weldability;

By default, vias will open windows in the design (override: 0.1016 mm), that is, the via holes expose copper foil, expand by 0.1016 mm, and tin will be applied during wave soldering. If the design is to prevent tin on the vias and avoid copper exposure, the marking option in the additional attribute of the via must be checked to close the via opening.

In addition, this layer can also be used for non electrical wiring, so the green oil of solder mask should be opened accordingly. If it is on the copper foil wiring, it is used to enhance the over-current capacity of the wiring and add tin treatment during welding; if it is on the non copper foil wiring, it is generally designed to do identification and special character screen printing, and the character silk screen layer can be omitted.

4. Top / bottom paste:

This layer is generally used for solder paste during SMT reflow process of SMT of SMT components. It has nothing to do with PCB manufacturer's board making. It can be deleted when exporting Gerber, and can be maintained by default during PCB design.

5. Top / bottom overlay:

It is designed for various silk screen marks, such as component tag number, character, trademark, etc.

6. Mechanical layers:

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It is designed as PCB mechanical shape, and layer1 is the shape layer by default. Other layer2 / 3 / 4 can be used for mechanical dimension marking or special purposes. For example, when some boards need to make conductive carbon oil, layer2 / 3 / 4 can be used, but the purpose of this layer must be clearly marked on the same layer.

7. Keepout layer:

In order to prohibit wiring layer, many designers also use it to make PCB mechanical shape. If there are keepout and mechanical layer1 on the PCB, it mainly depends on the shape integrity of these two layers. Generally, mechanical layer1 shall prevail. It is suggested that mechanical layer1 be used as the shape layer as much as possible in design. If the keepout layer is used as the shape layer, the mechanical layer1 should not be used again to avoid confusion!

8. Midlayers:

It is mostly used in multi-layer board, but seldom used in our design. It can also be used as a special purpose layer, but the purpose of the layer must be clearly identified in the same layer.

9. Internal plans:

For multi-layer board, our design is not used.

10. Multi layer:

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Through hole pad layer.

11. Drill guide:

The center positioning coordinate layer of pad and through hole drilling.

12. Drill drawing:

Description layer of hole size of pad and through hole.

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